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Plasma Etching Gas

Octafluorocyclobutane is an important etching gas in the plasma etching process of the electronics industry.

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Product Availability

Sample

Available

Commercial

Available

ISO Tank

Available

Custom Packaging

Upon Request


Product Description

Chemical Name

Octafluorocyclobutane

Synonyms

Perfluorocyclobutane, R-C318

CAS #

115-25-3

ELINCS # (EU)

204-075-2

Molecular Formula

CC4F8

Structure

 

Molecular Weight

200.03

ODP(CFC-11 = 1)

0

GWP100(CO2 = 1)

3200

Atmospheric Life Time (Days)

10300


Product Properties

Chemical Name

Octafluorocyclobutane

Boiling Point(℃)

-5.8

Melting Point(℃)

-40.1

Liquid Density ( -5.8℃, g/cm³)

1.637

Vapor Density (Air=1)

7.0

Saturated Vapor Pressure(@20℃, bar)

2.7

Critical Temperature(℃)

115.3

Critical Pressure(MPa)

2.79

Solubility in water (mg/L)

140

Flash Point(℃)

Not applicable (non-flammable)

Flammability (@21℃)

Not applicable (non-flammable)

Explosion Limit(%vol)

Not applicable (non-flammable)


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