Trifluoromethane is an important etching gas in the plasma etching process of the electronics industry.

Hexafluoro-1,3-butadiene (C4F6, also known as perfluorobutadiene, HFBD) is used as an environmentally friendly etching gas with a low greenhouse effect, mainly in dry etching processes for semiconductors.

COF2, or carbon tetrafluoride, is an electronic semiconductor gas that is primarily used in the plasma etching process to remove material from the wafer to create intricate patterns and designs for further processing.

Octafluorocyclobutane is an important etching gas in the plasma etching process of the electronics industry.

Hexafluoropropylene is a monomer used to produce fluoropolymers like fluoroelastomers F20-41, F246, and fluoroplastics F46. It also serves as a raw material for perfluorosulfonic acid membranes, fluorocarbon oils, and perfluoropropylene oxide.

Hexafluoroisobutylene (HFIB) is an environmentally friendly dry etching gas with low GWP, mainly used in front end etching process of semiconductor.

Acetylene is essential in semiconductor manufacturing, widely used for cleaning and etching. Its high solubility allows efficient chemical removal and surface cleaning, making it an effective, environmentally friendly agent for preparing and maintaining semiconductor surfaces.

Hydrogen bromide is a colorless, corrosive, liquified, compressed gas widely used in the etching process of semiconductor chips.

Nitrogen trifluoride is a colorless, odorless, stable gas and a strong oxidizer. In the microelectronics industry, it serves as a plasma etching gas, generating active fluorine ions with high etching rates and selectivity for silicon, silicon oxide, and tungsten compounds.

Difluoromethane is an important etching gas in the plasma etching process of the electronics industry.

Pentafluoroethane is an important etching gas in the plasma etching process of the electronics industry.

Propylene (C3H6) is used in many processes from semiconductors, plastics, and calibration mixtures. Propylene can be polymerized to produce other polymers like polypropylene. As an intermediate, propylene can be used in chemical reactions to generate substances that is then deposited on the surface of a semiconductor substrate. Additionally, propylene can be used in calibration gas mixtures.

Iodotrifluoromethane (CF3I) is an environmentally friendly dry etching gas with low GWP，mainly used in front end etching process of flash memory chips manufacturing.

Ethylene gas (C2H4) is used in semiconductor manufacturing via gas-phase transport and surface treatment. It also serves in polymer production, such as polyethylene, and as a fruit ripening agent.

N2O is a semiconductor processing gas.

Octafluoropropane is an important etching gas in the plasma etching process of the electronics industry.

Trifluoromethane is an important etching gas in the plasma etching process of the electronics industry.